TEAC
TEAC

Introduction of Load Cells for Semiconductor Manufacturing Processes and Board Mounting Processes

TEAC Load Cell Features

  • TEAC's load cells are used in the semiconductor manufacturing process, from crystal growth to reliability inspections.

Customized production is also available.

Lineup by Process

Ingot pulling

A polycrystal is melted in a quartz crucible and pulled while rotating the seed crystal rod to make a single crystal ingot (ingot pulling by the CZ method).

Applicable products: Single crystal growth load cell *This item is available only in Japan.

引上機用ロードセル TT-XNⅡ / TT-XNⅡ(G)
TT-XNⅡ / TT-XNⅡ(G)
引上機用ロードセル TT-XNS / TT-XNS(G)
TT-XNS / TT-XNS(G)
Model TT-XNⅡ (Atmospheric pressure type)
TT-XNⅡ(G) (Atmospheric pressure gas purge type)
TT-XNS (Atmospheric pressure type)
TT-XNS(G) (Atmospheric pressure gas purge type)
Rated Capacity (R.C.) Low capacity section: 100N High capacity section: 500N 20N - 500N
Safe overload of 500% 600N 120% R.C.
Overload protection* Equipped Equipped
Weight (Approx.) 8kg 8kg
Accessory φ6, 6-core shieded cable, 1m, NDIS plug-end φ10, 6-core shielded cable, 0.5m, NDIS plug-end

*Overload protection

TT‐XNⅡ:
Protecting the load cell with a mechanical stopper at approximately 120% load in the direction of gravity. In the opposite direction of gravity (pushing-up direction), the load transmission component will be disconnected from the load cell to protect the load cell.
TT‐XNS:
Protecting the load cell with a mechanical stopper between 110% to 120% load in the direction of gravity, and at approximately 120% load in the opposite direction (pushing-up direction).

Applicable products:For pulling large diameter silicon wafers

Model TU-PGRS☐☐N/KN-G
Rated Capacity (R.C.) 2kN - 5kN
Type Tension / Compression Load Cell
Merit High precision
Dimensions
Wafer polishing (polishing and lapping)

Used to control the pressing pressure when polishing (lapping and polishing) silicon wafers.

Measure the force of the table

Applicable products:Polisher

Model TC‐FR(T)☐☐N‐G6 TC-NSRSP(T)☐☐N-G3 TU-PGRS☐☐N/KN-G
Rated Capacity (R.C.) 200N - 500N 50N - 500N 100N - 500N
Type Compression Load Cell Compression Load Cell Tension / Compression Load Cell
Merit Button type Adopt thin-film strain gage formed by sputtering.
High responsivity
High precision
Dimensions Dimensions Dimensions

Applicable products:Lapper

Model TU-GR☐☐KN-G TU-NR-C☐☐KN-G TU-MXR2(T)☐☐N-G3
Rated Capacity (R.C.) 5kN - 1kN - 100N - 500N
Type Tension / Compression Load Cell Tension / Compression Load Cell Tension / Compression Load Cell
Merit Shear beam-Type
Deflection proof and fatigue proof
Shear beam-Type
Deflection proof and fatigue proof
For small polishing equipment
Dimensions Dimensions Dimensions
Wafer inspection (prober)

Used for load control when testing the electrical characteristics of chips formed on wafers.

Probe card load management

Applicable products

Model TU-GR☐☐KN-G TU-NR-C☐☐KN-G TU-CR(T)☐☐N/KN-G6
Rated Capacity (R.C.) 5kN - 1kN - 1kN・2kN
Type Tension / Compression Load Cell Tension / Compression Load Cell Tension / Compression Load Cell
Merit Shear beam-Type
Anti‐eccentricity and
fatigue resistance
Sleek Design
Shear beam-Type
Anti‐eccentricity and
fatigue resistance
High precision, Beam-type
Dimensions Dimensions Dimensions
Bonding

Used for load measurement at bonding.

Applicable products:Chip on board

Purpose Pressures Pressures Pressures Pressures
Model TC-USR(T)29☐☐N-G3 TC-NSRSP(T)☐☐N-G3 TC-SR(T)50N-G TC-SR(T)100N-G3
Rated Capacity (R.C.) 50N・100N 50N・100N 50N 100N
Type Compression Load Cell Compression Load Cell Compression Load Cell Compression Load Cell
Merit With stopper
High performance
High responsivity
Adopt thin-film strain gage formed
by sputtering.
Button type Button type
Dimensions Dimensions Dimensions Dimensions
Purpose Wire Tensile Strength
Model TU-MBR(T)☐☐N-G3
Rated Capacity (R.C.) 2N・5N・10N・20N
Type Tension / Compression Load Cell
Merit Safe Overload Rating
Dimensions

Applicable products:Flip Chip Bonder/Die Bonder

Purpose Pressures Pressures Pressures
Model TC-NSRSP(T)☐☐N-G3 TC-SR(T)☐☐N-G TC-MFSR(T)☐☐N-G
Rated Capacity (R.C.) 50N・100N 20N・50N 20N・50N
Type Compression Load Cell Compression Load Cell Compression Load Cell
Merit High responsivity
Adopt thin-film strain gage formed by sputtering.
Button type Flat load point
Dimensions Dimensions Dimensions
Test equipment (IC test handler)

Used for load control of IC test handlers.

Applicable products:

Model TC-NSRSP(T)☐☐N-G3 TC-SR(T)☐☐N-G TC-SR(T)100N-G3
Rated Capacity (R.C.) 50N・100N 20N・50N 100N
Type Compression Load Cell Compression Load Cell Compression Load Cell
Merit High responsivity
Adopt thin-film strain gage formed by sputtering.
Button type Button type
Dimensions Dimensions Dimensions
Surface Mounter

Used for load control of chip mounters to place electronic components on printed circuit boards

Applicable products

Model TC-SR(T)☐☐N-G TC-MFSR(T)☐☐N-G TC-USR(T)29☐☐N-G3
Rated Capacity (R.C.) 20N・50N 20N・50N 20N・50N
Type Compression Load Cell Compression Load Cell Compression Load Cell
Merit Button type Flat load point With stopper
Dimensions Dimensions Dimensions
Liquid medicine management

Manages the remaining amount of liquid and gas cylinders.

Applicable products:Floor Scale

TL-LF

Model TL-LF
Weight (Approx.) 0.4kg
Rated Capacity (R.C.) 0.6/1/3kg
Safe overload 120%
Merit Small
Dimensions

TL-PM

Model TL-PM12 TL-PM18 TL-PM21
Weight (Approx.) 0.7kg 1.4kg 1.7kg
Rated Capacity (R.C.) 10/20/50kg
Safe overload 150%
Merit Small
Dimensions

TL-PS

Model TL-PS18 TL-PS21 TL-PS25 TL-PS28
Weight (Approx.) 2.0kg 2.7kg 3.8kg 4.5kg
Rated Capacity (R.C.) 10/20/50kg 20/50/100/200kg
Safe overload 150%
Merit Standard type
Dimensions
Model TL-PS33 TL-PS42
Weight (Approx.) 6.2kg 11.1kg
Rated Capacity (R.C.) 50/100/200kg 100/200/300kg
Safe overload 150%
Merit Standard type
Dimensions